CHIP-PKG-PCB Co-Design Methodology

For digital devices integrating an image-processing LSI, performance improvement, cost cutting and reduction of the time to market are essential conditions for surviving in the increasingly competitive global market. At the same time, more and more image-processing LSIs are taking the form of large-scale system-on-a-chip (SoC). It is becoming harder to design them as the degree of integration increases, and signal and power integrity issues are appearing due to their processing speed increase and voltage reduction. As a design methodology to address four challenges in recent SoC design (signal and power integrity issues, high-density design, reduction of design turnaround time [TAT], and cost cutting), Fujitsu Semiconductor has established chip-package-printed circuit board (CHIP-PKG-PCB) co-design methodology and made achievements contributing to first-shot full operation of SoCs and digital devices that integrate them. This paper presents our approach to the CHIP-PKG-PCB co-design for dealing with the four challenges above by giving case examples.